About the Position: This position is being announced at the GS-11, GS-12 and GS-13 grade level. The incumbent may be selected at any of the grade levels depending on level of experience. This position is within the Department of Defense, Defense Microelectronics Activity, within the Microelectronics Design and Integration Division. DMEA Microelectronics Design and Integration Division supports a wide variety of microelectronics products and processes including, but not limited to Application Specific Integrated Circuits (ASIC) design, Field Programmable Gate Array application and other microcircuit and miniaturization designs and implementation in support of DoD Weapon Systems technology insertions and new project development.Learn more about this agency
- At the target grade level, the incumbent is responsible for the development, coordination and implementation of cross discipline product development activities.
- Uses advanced microelectronics CAD software to design the microcircuits and simulate the design?s functionality.
- Leads or supports Interdisciplinary Engineering Teams, including collaboration with other engineers and technical specialists from multiple disciplines in order to meet dynamic and frequently changing electronic project needs.
- Works on projects that include digital / analog / mixed signal designs, ASICs, circuit cards and other miniaturization activities.
Occasional travel - You may be expected to travel up to 5% for this position.
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This job originated on www.usajobs.gov. For the full announcement and to apply, visit www.usajobs.gov/GetJob/ViewDetails/496037600. Only resumes submitted according to the instructions on the job announcement listed at www.usajobs.gov will be considered.